Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->
Contents
FinOracleAI — Market ViewPerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewPerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewRapid Commercial Adoption and Expanding Customer BasePerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewRapid Commercial Adoption and Expanding Customer BasePerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewFour New Product Applications Targeting Robotics and Semiconductor IndustriesRapid Commercial Adoption and Expanding Customer BasePerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewBio-Inspired Adhesive Technology with Industrial PotentialFour New Product Applications Targeting Robotics and Semiconductor IndustriesRapid Commercial Adoption and Expanding Customer BasePerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market ViewgeCKo Materials Debuts Four Advanced Dry Adhesive Products at TechCrunch Disrupt 2024Bio-Inspired Adhesive Technology with Industrial PotentialFour New Product Applications Targeting Robotics and Semiconductor IndustriesRapid Commercial Adoption and Expanding Customer BasePerformance Breakthrough in Semiconductor Wafer HandlingFinOracleAI — Market View
FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
Rapid Commercial Adoption and Expanding Customer Base
Prior to the product launch, geCKo Materials secured significant customers including Ford, NASA, and Pacific Gas & Electric. The company’s technology has also featured on six space missions over the past year, demonstrating its robustness in vacuum and extreme environments. !-- wp:paragraph -->“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
- A semiconductor wafer handling tool designed to safely and rapidly manipulate wafers.
- A robotic gripper optimized for smooth surfaces such as solar panels and glass.
- A curved robotic “end effector” suited for irregularly shaped objects.
- An all-purpose gripper adaptable for robotic arms across diverse applications.
Rapid Commercial Adoption and Expanding Customer Base
Prior to the product launch, geCKo Materials secured significant customers including Ford, NASA, and Pacific Gas & Electric. The company’s technology has also featured on six space missions over the past year, demonstrating its robustness in vacuum and extreme environments. !-- wp:paragraph -->“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
- A one-inch tile can support up to 16 pounds.
- The adhesive can be reused up to 120,000 times without degradation.
- It maintains adhesion for durations ranging from seconds to years.
Four New Product Applications Targeting Robotics and Semiconductor Industries
At the event, Dr. Kerst introduced four new uses for geCKo’s dry adhesive: !-- wp:paragraph -->- A semiconductor wafer handling tool designed to safely and rapidly manipulate wafers.
- A robotic gripper optimized for smooth surfaces such as solar panels and glass.
- A curved robotic “end effector” suited for irregularly shaped objects.
- An all-purpose gripper adaptable for robotic arms across diverse applications.
Rapid Commercial Adoption and Expanding Customer Base
Prior to the product launch, geCKo Materials secured significant customers including Ford, NASA, and Pacific Gas & Electric. The company’s technology has also featured on six space missions over the past year, demonstrating its robustness in vacuum and extreme environments. !-- wp:paragraph -->“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
Bio-Inspired Adhesive Technology with Industrial Potential
geCKo’s adhesive technology draws inspiration from the gripping mechanism of lizard feet. According to founder Dr. Capella Kerst, the material functions akin to a new type of Velcro—offering strong adhesion without leaving residue, requiring no electrical power or suction, and allowing rapid attachment and detachment. !-- wp:paragraph -->- A one-inch tile can support up to 16 pounds.
- The adhesive can be reused up to 120,000 times without degradation.
- It maintains adhesion for durations ranging from seconds to years.
Four New Product Applications Targeting Robotics and Semiconductor Industries
At the event, Dr. Kerst introduced four new uses for geCKo’s dry adhesive: !-- wp:paragraph -->- A semiconductor wafer handling tool designed to safely and rapidly manipulate wafers.
- A robotic gripper optimized for smooth surfaces such as solar panels and glass.
- A curved robotic “end effector” suited for irregularly shaped objects.
- An all-purpose gripper adaptable for robotic arms across diverse applications.
Rapid Commercial Adoption and Expanding Customer Base
Prior to the product launch, geCKo Materials secured significant customers including Ford, NASA, and Pacific Gas & Electric. The company’s technology has also featured on six space missions over the past year, demonstrating its robustness in vacuum and extreme environments. !-- wp:paragraph -->“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
geCKo Materials Debuts Four Advanced Dry Adhesive Products at TechCrunch Disrupt 2024
Runner-up in the 2024 TechCrunch Disrupt Startup Battlefield, geCKo Materials, returned to the Disrupt stage to unveil four new applications of its proprietary super-strong dry adhesive technology. The company aims to accelerate the commercialization of its innovative adhesive solutions across multiple industries. !-- wp:paragraph -->Bio-Inspired Adhesive Technology with Industrial Potential
geCKo’s adhesive technology draws inspiration from the gripping mechanism of lizard feet. According to founder Dr. Capella Kerst, the material functions akin to a new type of Velcro—offering strong adhesion without leaving residue, requiring no electrical power or suction, and allowing rapid attachment and detachment. !-- wp:paragraph -->- A one-inch tile can support up to 16 pounds.
- The adhesive can be reused up to 120,000 times without degradation.
- It maintains adhesion for durations ranging from seconds to years.
Four New Product Applications Targeting Robotics and Semiconductor Industries
At the event, Dr. Kerst introduced four new uses for geCKo’s dry adhesive: !-- wp:paragraph -->- A semiconductor wafer handling tool designed to safely and rapidly manipulate wafers.
- A robotic gripper optimized for smooth surfaces such as solar panels and glass.
- A curved robotic “end effector” suited for irregularly shaped objects.
- An all-purpose gripper adaptable for robotic arms across diverse applications.
Rapid Commercial Adoption and Expanding Customer Base
Prior to the product launch, geCKo Materials secured significant customers including Ford, NASA, and Pacific Gas & Electric. The company’s technology has also featured on six space missions over the past year, demonstrating its robustness in vacuum and extreme environments. !-- wp:paragraph -->“Has this year flown by as quickly for anybody else as it has for us?” asked Dr. Kerst during her presentation. She highlighted the company’s growth, including tripling the team size and completing an $8 million fundraising round since last year’s Disrupt event. Demonstrations included a Fanuc robotic arm equipped with six geCKo adhesive tiles, showcasing swift and secure object manipulation. Video presentations further illustrated the adhesive’s application in semiconductor wafer handling, outperforming traditional suction technologies.
!-- wp:paragraph -->Performance Breakthrough in Semiconductor Wafer Handling
Dr. Kerst revealed that leading semiconductor manufacturers TSMC, Samsung, Intel, and Kawasaki set a target acceleration of 2Gs for wafer movement. geCKo’s material exceeded this by achieving 5.4Gs of acceleration repeatedly and reliably, marking a significant advancement over existing technologies. !-- wp:paragraph -->FinOracleAI — Market View
geCKo Materials is poised to disrupt multiple high-tech industries by leveraging its bio-inspired dry adhesive technology. Its ability to deliver strong, residue-free, and reusable adhesion in diverse environments offers substantial operational advantages over conventional gripping and suction methods. !-- wp:paragraph -->- Opportunities: Expansion into semiconductor manufacturing, robotics automation, aerospace applications, and clean energy sectors.
- Risks: Scaling manufacturing capabilities, maintaining adhesive performance over large-scale deployments, and competition from established adhesive and gripping technologies.
