Google’s Upcoming Tensor G4 Chip Set to Improve Heat Management and Power Efficiency with Samsung Collaboration
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In an effort to enhance power efficiency and heat management, Google’s highly anticipated Tensor G4 chip will be adopting an advanced packaging method developed by Samsung. The use of the newer Fan-out Wafer Level Packaging (FOWLP) method in the Tensor G4 is expected to result in notable improvements in both areas.
Despite being a relatively minor upgrade over its predecessor, the G3 chip, Google’s focus on optimizing heat management and power efficiency is worth noting. As such, tech enthusiasts and industry experts are eagerly awaiting the release of the Tensor G4 in the upcoming Pixel 9 series and Pixel Fold 2.
Moreover, reports suggest that Google and Samsung are collaborating closely on the development of the Tensor G4. The chip will incorporate Samsung’s latest 4nm process and packaging technique, building upon the success of Samsung’s previous contribution to the improved heat management of the G3 chip.
However, the collaboration between Google and Samsung may be short-lived. It has been hinted that Google is planning to shift away from Samsung for its future Tensor G5 chip, which is expected to debut in the Pixel 10 series in 2025. Instead, Google is said to favor Taiwan Semiconductor Manufacturing Company (TSMC), renowned for producing chips with superior power efficiency in collaboration with industry giants like Qualcomm and MediaTek.
The advancements in power efficiency and heat management offered by the Tensor G4 chip demonstrate Google’s commitment to continuously improving its flagship Pixel devices. With its collaboration with Samsung and potential future partnerships with other industry leaders, Google is poised to deliver cutting-edge technology that excels in performance, efficiency, and user experience.
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Analyst comment
This news can be evaluated as positive. The upcoming Tensor G4 chip from Google, in collaboration with Samsung, will enhance power efficiency and heat management, resulting in notable improvements. This indicates Google’s commitment to continuously improving its flagship Pixel devices. In the short term, the release of the Tensor G4 in the upcoming Pixel 9 series and Pixel Fold 2 is eagerly awaited. However, future collaborations with Samsung may be short-lived as Google plans to shift to Taiwan Semiconductor Manufacturing Company (TSMC) for its Tensor G5 chip in 2025.
